| Mfg Part Number: M38510 20302BEB | Alternate P/N: M3851020302BEB | NSN : 5962-01-143-0828 |
| NIIN : 011430828 | CAGE Code : 50364 | Manufacturer: Mmi Amd |
| Item Name : Microcircuit Memory | FSC : 5962 Microcircuits Electronic |
When you need top quality NSN parts that you can steadily rely on, let the experts at Stacked NSN help you secure all you need with competitive pricing and rapid lead-times. NSN 5962-01-143-0828 is listed with the part number M38510 20302BEB and was manufactured by Mmi Amd. If you are interested in purchasing our available Microcircuit Memory, fill out and submit the RFQ form as provided below for the part number M38510 20302BEB. and a dedicated account manager will reach out to you in as little as 15 minutes or less. As you complete our request form, we ask that you offer us as much information as you can so that we may best accommodate your needs.
This Mmi Amd NSN part was produced under the CAGE Code 50364, and customers can find all the NSNs that they require with ease by utilizing our search engine and filters. NSNs, or National Stock Numbers, are 13-digit numeric codes assigned to ‘standardized material items of supply’ for ease of trade. The NSN system is practiced by all NATO members and other participating countries, and such codes help identify the part’s country of origin, FSG, FSC, and more. Get started on the purchasing process for NSN 5962-01-143-0828 and other items you need today and see why customers choose to steadily rely on Stacked NSN for all their needs.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-143-0828 Item Description: Microcircuit Memory | 5962 | 011430828 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| M38510 20302beb | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.840 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 739.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND SCHOTTKY AND PROGRAMMABLE AND W/ACTIVE PULL-UP |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-2 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
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